Wafer Polishing

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Wafer Polishing

PureGaNtm is a breakthrough in GaN quality that unlocks the true versatility and value of vertical GaN power devices. Kyma's proprietary HVPE technology allows thick GaN films with extremely high chemical purity to be grown. When making the n-type drift layers for vertical power devices, the free electron concentration of the undoped films can be made to be much lower than GaN produced by other methods. The key to our technology lies in our reactor design. We keep out the background impurities that unintentionally dope as well as those that compensate the films:

Product Details


  • Automated wafer polishing systems for compound semiconductors
  • Precise control over material removal rates and surface finish
  • Capabilities for a wide range of wafer sizes and materials
  • Advanced slurry delivery and conditioning systems
  • In-situ monitoring and endpoint detection
  • Customizable polishing recipes and process integration


  • Superior surface planarity and ultra-low roughness
  • Exceptional total thickness variation (TTV) control
  • Minimized subsurface damage and defects
  • Improved yield and throughput for wafer production
  • Extended tool lifetime and reduced consumables costs
  • Versatile polishing solutions for diverse applications


  • Polishing of III-Nitride (GaN, AlN, InN) substrates and templates
  • Surface preparation for epitaxial growth processes
  • Polishing of SiC, Sapphire, and other compound semiconductor wafers
  • Planarization and smoothing of epitaxial layers and device structures
  • Wafer thinning and backside polishing for device fabrication
  • Polishing of optical and optoelectronic materials (lasers, LEDs)
  • Customized polishing solutions for research and pilot production

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