Full Wafer Processing

Kyma Technologies offers a full line of wafer processing services, including:

• Dicing: Kyma’s wafering department features single and multi-wire saws that utilize Kyma’s patent-pending diamond wire technology for precise and affordable dicing. Substrate size capabilities range from 700µm x 700µm squares to 100mm diameter discs with a dimensional tolerance of +/- 0.1mm for squares and +/-0.1mm for discs.

• Grinding: Also located in the wafering department, Kyma’s custom built grinding tools are exceptional for creating a high level of flatness efficiently and with low damage incidence to wafers. Kyma’s tools are fully capable of meeting your roughness and size specifications.

• Polishing: Kyma offers a state-of-the-art polishing processes which utilizes planarization, lapping, and CMP tools for substrate sizes up to 4 inches diameter. The process includes optical and epi-ready finishes. Epi-ready finishes have a consistent RMS of

Kyma Terms and Conditions