Full Wafer Characterization

Kyma Technologies offers a wide range of material analytical services including:

• Thickness: Contactless measurements of semiconductor thin films ranging from 150Å to 450µm with sizes from 5mm x 5mm squares to 100mm in diameter.

  Contactless single-probe, multi-point thickness mapping and bow measurement of thin and thick films on substrates up to 4 inches in diameter.

• Resistance: Contactless, high-resistivity measurement of semi-insulating semiconductor bulk substrates ranging from 5x104 to 5x109 Ohm-cm with sizes from 10mm x 10mm squares to 6 inches diameter and thicknesses between 350 and 650um.

  Non-destructive measurement of sheet resistance, resistivity and thickness of semiconductor bulk substrates and thin films ranging from 0.035 to 3000 Ohms/square with sizes from 5mm x 5mm squares to 100mm in diameter.

• Surface morphology: White light interferometer contactless surface morphology mapping of thin and thick film substrates. Dimensions capability includes 1mm x 1mm to 4 inches in diameter.