Custom Services

In the field of nitride semiconductors, there are many services needed to prepare wafers for production. Kyma offers these services.

Full Wafer Characterization

Kyma Technologies offers a wide range of material analytical services including:

Thickness: Contactless measurements of semiconductor thin films ranging from 150Å to 450µm with sizes from 5mm x 5mm squares to 100mm in diameter.

Contactless single-probe, multi-point thickness mapping and bow measurement of thin and thick films on substrates up to 4 inches in diameter.
Resistance: Contactless, high-resistivity measurement of semi-insulating semiconductor bulk substrates ranging from 5x104 to 5x109 Ohm-cm with sizes from 10mm x 10mm squares to 6 inches diameter and thicknesses between 350 and 650um.

Non-destructive measurement of sheet resistance, resistivity and thickness of semiconductor bulk substrates and thin films ranging from 0.035 to 3000 Ohms/square with sizes from 5mm x 5mm squares to 100mm in diameter.
Surface morphology: White light interferometer contactless surface morphology mapping of thin and thick film substrates. Dimensions capability includes 1mm x 1mm to 4 inches in diameter.

Full Wafer Processing

Kyma Technologies offers a full line of wafer processing services, including:

Dicing: Kyma’s wafering department features single and multi-wire saws that utilize Kyma’s patent-pending diamond wire technology for precise and affordable dicing. Substrate size capabilities range from 700µm x 700µm squares to 100mm diameter discs with a dimensional tolerance of +/- 0.1mm for squares and +/-0.1mm for discs.
Grinding: Also located in the wafering department, Kyma’s custom built grinding tools are exceptional for creating a high level of flatness efficiently and with low damage incidence to wafers. Kyma’s tools are fully capable of meeting your roughness and size specifications.
Polishing: Kyma offers a state-of-the-art polishing processes which utilizes planarization, lapping, and CMP tools for substrate sizes up to 4 inches diameter. The process includes optical and epi-ready finishes. Epi-ready finishes have a consistent RMS of