Super-Abrasive Diamond Wire

Kyma is selling demonstration quantities (1-5 km) of our patent pending diamond wire. This super-abrasive wire is used to cut high hardness materials like GaN, SiC, sapphire and many other semiconductor and ceramic materials. As our wire production volume increases, we believe this will be the highest quality and lowest cost diamond wire available in the world. Furthermore, we intend to offer diamond wire production tools when our capacity nears its peak for the ultimate in cost reduction potential for our largest customers.

Advantages of Kyma Diamond Wire:

  • Steel Core + Metal Matrix
    • Stronger than steel + epoxy
    • Less costly than steel + electroplating
  • Excellent thermal conductivity and overall wire lifetime
  • We load wire directly onto customer provided wire-saw spools
  • Suitable for water cooled single-wire or multi-wire saw configurations
  • Eventual sale of our wire manufacturing tool so that high volume customers can further reduce wire usage costs
Diamond Wire (Specification sheet)
Wire Grade Length Wire Outer Diameter
(including diamonds)
Diamond Size Part Number
Demonstration Grade 1 km 270-300µm 20µm DW.300.20.1 Inquire
Demonstration Grade 1 km 250µm 40µm DW.250.40.1 Inquire
Customer preferences will vary and may prefer adjustment to the wire properties to favor:
  • Fast cutting speed
  • Long lifetime
  • Smooth surface finish
  • Minimum kerf loss
Inquire

Based on customer feedback, we intend to further diversify the wire diameter, diamond particle size, and coating thickness specifications in order to optimize for each of these options.



 

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